We design and support ultra-clean fabrication environments down to Sub-Class 1 and ISO Class 1-3. Our engineers manage precise laminar airflow velocities, ultra-low penetration air (ULPA) filtration, and strict electrostatic discharge (ESD) mitigation protocols to protect sensitive electronic assembly.
Microchip production relies on flawless utility delivery. We design and install high-purity mechanical and electrical systems, ensuring clean utility distribution and highly stable LV to MV power distribution (up to 22 kV) to prevent fatal operational interruptions.
To prevent microscopic defects on wafers, we integrate advanced HVAC architecture designed to tightly control temperature and humidity while aggressively filtering out particulate and airborne molecular contamination (AMC).
Nanometer-scale processes are sensitive to the smallest motion. We coordinate vibration isolation, equipment foundations, and structural integration with the mechanical and electrical design — keeping critical tools within tolerance and minimizing transmitted vibration from facility systems
